| 摘要 |
PROBLEM TO BE SOLVED: To provide a metallic mold for resin sealing in which a heat spreader set in a metallic mold can be held, and the positioned deviation of the heat spreader when it is incorporated in a package can be suppressed. SOLUTION: This metallic mold for resin sealing is constituted of a lower metallic mold 1A having a cavity and an upper metallic mold 1B, and a heat spreader 4A is placed in the cavity of the lower metallic mold 1A, an island 5 of a lead frame to which a semiconductor chip 6 is fixed is placed on the heat spreader 4A, an outside lead 7 of the lead frame is interposed between the lower metallic mold 1A and the upper metallic mold 1B, and a resin 10 is introduced. A groove 3A for fixing the lowermost face of the heat spreader 4A is provided on the bottom face part of the cavity of the lower metallic mold 1A. |
