Cathodic sputtering apparatus with adjustable target

摘要

A cathodic sputter deposition apparatus has one or more sputter targets (32, 42, 52) which match the substrate (60). The targets can be inserted into one or more cavities (70, 80, 90) defined by one or more substrate faces (72, 74, 82, 84, 92, 94) to be coated. Preferably, the or each sputter cathode (30, 40, 50) is loosely mounted on a holder plate (15), so that the distance between the or each cathode and the holder plate can be varied. There is a tubular anode (37, 47, 57) which holds the insulated target at one end and which can be displaced through an opening in the holder plate (15). Also claimed is a magnetron sputter cathode for use in the above apparatus. The cathode includes a cylindrical target which has side and front sputter faces and which contains a cavity for accommodating a magnet. Further claimed is an arrangement for use in the above apparatus, comprising several individually controllable sputter cathodes with target surfaces matching the shape of the substrate to be coated.