Polishing method and polishing apparatus using the same

摘要

This specification discloses a polishing method of polishing the surface of a film layer (5a) provided on the surface of a substrate (5b) by polishing means (4) with both of them driven relative to each other, having the position detecting step of detecting a predetermined position on the surface of the film layer (5a), the first measuring step of applying momentary light from a light source to the predetermined position, and detecting the light beam from the predetermined position by a light receiving element to thereby measure the film thickness at the predetermined position, and the controlling step of controlling the polishing state by using data obtained at the first measuring step. The specification also discloses a polishing apparatus (1) using such polishing method.