发明名称 Surface acoustic wave device mounted module
摘要 <p>This invention provides a surface acoustic wave device mounted module which is miniature, light, and highly reliable. The surface acoustic wave device mounted module also has excellent frequency characteristics. The surface acoustic wave device mounted module includes a multilayer substrate 8 which has at least one layer of a shield pattern 12, input-output electrodes 10, grounding electrodes 11, via holes 9 used for connecting electrodes, and a surface acoustic wave element 1. The surface acoustic wave element has metallic bumps 5, which are transfer-coated with a conductive resin 6, on electrode pads; an insulating resin 7 around the surface acoustic wave element; and an inter-digital transducer 4. The electrode pads are input-output terminals 2 and grounding terminals 3 formed on the surface acoustic wave element. Continuities between the input-output terminals and the input-output electrodes, and between the grounding terminals and the grounding electrodes are established by the via holes. An electrode pattern 14 is formed on the surface of the multilayer substrate facing and surrounding the surface acoustic wave element. A metallic lid 13 is attached to the electrode pattern by a solder or conductive resin 15 so that the surface acoustic wave element is sealed in an airtight condition. The electrode pattern is connected to the grounding electrodes by the via holes. &lt;IMAGE&gt;</p>
申请公布号 EP0637871(B1) 申请公布日期 1998.12.16
申请号 EP19940112070 申请日期 1994.08.02
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 ONISHI, KEIJI;SEKI, SHUNICHI;TAGUCHI, YUTAKA;EDA, KAZUO
分类号 H03H9/10;H03H9/02;H03H9/25;(IPC1-7):H03H9/05 主分类号 H03H9/10
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