| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and device of affixing a protection film for a semiconductor wafer, with which there is no risk that the wafer goes in distortion or breakage. SOLUTION: A semiconductor wafer W is placed on a table 201, and a protection film 109 is pressed to the wafer W by a press roller 107 installed opposing to the table 201, and the table 201 is moved and the film 109 is affixed to the wafer W. Upstream of the press roller 107, a tension roller 105 is installed to give a tensile force directed oppositely to the film feeding direction. The size of this tensile force should be set as large as generating a stretched condition of the protection film 109 at the time of starting the film affixation, and during the affixing operation, should be so small that the portion 109a where the film is not yet affixed does not attach to the wafer W.</p> |
