发明名称 |
Method for formation of capacitors |
摘要 |
A method of forming a capacitor for a DRAM includes the steps of: forming an insulating layer with a contact hole on a substrate; forming a first conductive layer on the insulating layer and in the contact hole; forming a temporary layer pattern on a portion of the first conductive layer corresponding to the contact hole; forming a second conductive layer on the first conductive layer and on the temporary layer pattern; selectively implanting oxygen ions into the first and second conductive layers except a portion of the second conductive layer corresponding to a side face of the temporary layer pattern; heat treating so as to convert the oxygen-ion-implanted first and second conductive layer portions into an oxide; removing the oxide and temporary layer pattern; forming a dielectric layer on the surface of the first and second conductive layers; and forming a third conductive layer on the dielectric layer.
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申请公布号 |
US5849619(A) |
申请公布日期 |
1998.12.15 |
申请号 |
US19960769627 |
申请日期 |
1996.12.18 |
申请人 |
LG SEMICON CO., LTD. |
发明人 |
CHO, WON-JU;YANG, WOUNS |
分类号 |
H01L27/04;H01L21/02;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L21/824;H01L21/20 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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