| 摘要 |
<p>An apparatus and method for aligning fine pitch electrical components (14) and for solder paste stenciling includes a template (20, 40) for aligning an electrical component (14) and for aligning a solder stencil (60, 70). The template (20, 45) has a window (30, 50) with shelves on opposite sides. Tape is adhered to the shelves across the window (30, 50) and is used to secure the template (20, 40) to the desired location on the printed circuit board (10). The template (20, 40) also includes upright tabs that engage notches (66, 76) in theedges of the stencil for aligning the stencil (60, 70). A two-headed vacuum lifting device (120) is used to lift an aligned component (14) and an aligned stencil (60, 70) from the template. With the template (20, 40) removed from the printed circuit board (10), the stencil (60, 70) is replaced in the aligned position for solder application. The stencil (60, 70) is removed and the electrical component (14) is placed for soldering.</p> |
