| 摘要 |
PROBLEM TO BE SOLVED: To provide a positioning device which can simultaneously superpose a mask on a wafer with high accuracy at a high speed and correct the warp of the wafer, and the method of the processing device. SOLUTION: A positioning device is provided with a light source 1 which emits alignment light, a means which projects the alignment light emitted from the light source 1 upon alignment patterns A-D on a substrate 9 at regular time intervals through reference alignment patterns a-d, a detecting means 23 which detects the light diffracted by the irradiated alignment patterns A-D, and an arithmetic means which performs arithmetic processing on the data of the detected light. The arithmetic means 25 detects the positional deviation of the substrate 9, by comparing the weakness pattern of the optical signals diffracted by the alignment patterns A-D on the substrate 9 with the data of the pattern by the intensity of the optical signals when the substrate 9 is deviated. |
