| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize a multi-chip, enable simplifying manufacturing process for an operational amplifier chip, reduce cost, and realize miniaturization of a package. SOLUTION: An operational amplifier chip 13 and a peripheral circuit chip 14 are mounted on chip-mounting parts 11, 12. The operational amplifier chip 13 is formed by semiconductor IC manufacturing process. A plurality of pads 15 arranged on the chip 13 are electrically connected with leads 16 of a package by using wires 17. In the peripheral circuit chip 14, a thin film capacitor and a thin-film resistor are formed on a board formed of ceramics or the like, by using known thin-film forming technique. A pad 18 on the chip 14 is electrically connected with leads 19 of the package by using wires 20.</p> |
