| 摘要 |
PROBLEM TO BE SOLVED: To enable coping with shipment for tens of kinds of packages by only mass producing one kind of IC packages and using them, making the design process time (trial manufacture to evaluation to/shipment) shortest and reducing the cost by changing various kinds of terminals different in form, attaching the terminals to one kind of the IC packages and manufacturing as products (shipment). SOLUTION: This package 11 is an IC package, wherein an IC chip 13 and lead-connecting members 14 which connect the part between electrodes arranged on the IC chip 13 are integrally molded into a unified body. The other ends of the lead-connecting members 14 are exposed to the outer surface of an IC package main body, receiving parts are formed on the other ends of the lead- connecting members 14, and lead terminals of isolated structure are made freely detachably fixed with respect to the receiving parts of the lead-connecting members 14. The receiving parts of the lead connecting members 14 are exposed to the bottom surface or the side surface of the IC package main body. |
