发明名称 TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To always supply a treating solution to ideal positions even when the size of a substrate to be treated is changed by providing backside treating nozzles so that the directions of the nozzles can be changed freely when the treating solution is supplied to the backside of a substrate to be treated from the backside treating nozzles while the substrate is held by means of a spin chuck. SOLUTION: A spin chuck 21 is supported by the upper end of the rotating shaft 26 of a motor 25 so that a substrate G to be treated may be rotated when the chuck 21 is rotated by means of the motor 25. A ring-shaped block 35 is arranged on the bottom 31 of a cup 22 below the substrate G held by the chuck 21 and nozzle bodies are attached to the peripheral surface of the block 35 at a plurality of spots. Then backside cleaning nozzle 32 are respectively attached to the nozzle bodies so that the directions of the nozzles 32 may be changed freely. Therefore, even when the size of the substrate G is changed, a treating solution, such as the rinsing solution, etc., can always be supplied to ideal positions.
申请公布号 JPH10321581(A) 申请公布日期 1998.12.04
申请号 JP19970144567 申请日期 1997.05.20
申请人 TOKYO ELECTRON LTD 发明人 YAMAGUCHI YASUMITSU;MURATA KAZUHIKO;UCHIHIRA NORIO;SAKAI MITSUHIRO
分类号 G03F7/30;B08B3/02;H01L21/027;H01L21/304;(IPC1-7):H01L21/304 主分类号 G03F7/30
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