| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent destruction phenomenon in a manufacturing process and improve anti-corrosion and characteristic against stress corrosion cracking, by forming an LOC-type lead frame of copper alloy of IACS having conductivity in a specified range. SOLUTION: An LOC-type lead frame 11, wherein a lead 12 extends on an element 10, is formed of copper alloy of IACS of 5-25%. The copper alloy contains Zn as first alloy component and one element selected out of a group of Sn, Si, Ni as second alloy component. As a result, a thermal expansion coefficient approximates that of the element 10 and a sealing resin 16, and an LOC package wherein destruction phenomenon is hardly generated and high in reliability is obtained. By covering Pd and Ru, reliability is more improved. Material cost is reduced more than in a conventional case, and mounting efficiency required by enlargement of an element which is to be caused by high level integration of a semiconductor device can be improved.</p> |
