DEVICE AND METHOD FOR BURN-IN AND TEST OF SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a system for temporarily connecting a flip-chip style chip to a device which can allows burn-in operation and test. SOLUTION: In a device for temporarily connecting a test jig or a burn-in jig 10 with a chip or a module 40 with projecting parts 42, an interposer 30 has recessed parts 32 at positions corresponding to positions of the projecting parts 42 on the chip or the module and metallizations 34 in the recessed part 32, and the recessed part 32 has a depth more than height of the projection part 42. Moreover, the interposer includes a means 38 for connecting a metallization 34 in each recessed part 32 to a contact corresponding to a contact on the test jig or the burn-in jig 10, and means 20, 50 for pressing the projecting part 42 against the side of each recessed part 32.