| 摘要 |
PROBLEM TO BE SOLVED: To remarkably reduce thermal resistance from semiconductor elements of a CSP package and a BGA package to a printed board, by forming a solder bump on the surface opposite to the surface of an area pad to which a semiconductor element is bonded, and making it possible for the solder bump to be bonded to a mounting printed board. SOLUTION: On the same surface of an insulating tape, the following are formed; inner electrodes 4a, 4a', outer electrodes 4-1-4-6, inner wirings 4b, 4b' which connect both of the electrodes, and an area pad 6 having large area. In a part of the insulating tape 2 where the area pad 6 is positioned, a hole smaller than the area pad 6 is formed, and a solder bump 5 for heat dissipation is arranged in the hole. The solder bump 5 is bonded to a surface of the area pad 6 which is opposite to the surface facing a semiconductor element 1. In the case of mounting on a printed board in which a wiring pattern and a pattern for heat dissipation are formed, solder bumps 3-1-3-6 are boded to the wiring pattern, and at the same time, the solder bump 5 for heat dissipation is bonded to the pattern for heat dissipation. |
