| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump formation method which prevents crack causing breakage in an aluminum pad. SOLUTION: A wire bump 3 is formed on an aluminum pad 2 of a chip 1, then the surface of the chip 1 is coated with a protective film 7. Next, the protective film 7 on the upper surface of the wire bump 3 is removed by plasma etching, and a solder bump 4 is formed on the upper surface of the wire bump 3. As the aluminum pad 2 exposed around the wire bump 3 is protected by the protective film 7, it is protected from flux used upon formation of the solder bump 4. Accordingly, crack due to corrosion caused by contact between the aluminum pad 2 and the flux is prevented. |
