发明名称 Wärmeableitendes Gehäuse zur Aufnahme von elektrischen oder elektronischen Bauteilen
摘要 The invention relates to a housing designed to accommodate at one printed board (12) having at least one electrical or electronic component (13) with a heat contact element (14). The housing consists of a light metal extruded section (1) forming a single piece and having accommodating contours (10, 11) in its interior for the printed board (12) and a contact surface (15) to support the heat contact element (14) of the appropriate component (13). In order to produce automatic heat contact between the heat contact element (14) and the contact surface (15) in the interior of the housing once the latter has been equipped, at least one of the sides (3, 4) can be expanded or is expanded in relation to the base side (2) and/or the opposite side of the extruded section in a starting position. By plastically deforming and directing said side (2) to its final position in its connection zone, pressure is automatically exerted upon the component (13) to be cooled, whose heat contact surface (14) is thus pressed against the contact surface (15) in the housing.
申请公布号 DE19722602(A1) 申请公布日期 1998.12.03
申请号 DE19971022602 申请日期 1997.05.30
申请人 LENZE GMBH & CO. KG, 31855 AERZEN, DE 发明人 HUEBNER, KARSTEN, 31855 AERZEN, DE;DIEHL, MARTIN, 31855 AERZEN, DE
分类号 H05K7/14;H05K7/20;(IPC1-7):H05K7/20;H05K5/02 主分类号 H05K7/14
代理机构 代理人
主权项
地址