Flame resistant resin composition useful for encapsulation of semiconductor devices

摘要

A flame resistant resin composition (I) comprises: (A) an epoxy resin, non-halogenated, having at least two epoxy groups per molecule; (B) a curing agent; and (C) a product resulting from the reaction of (C1) a phosphorous compound having at least one P-H bond per molecule, with (C2) a compound having at least one functional group comprising a C-C double bond, an epoxy group, an alcoholic hydroxy group or a carbonyl group, and at least one functional group consisting of an epoxy group, phenolic hydroxy group, amino group, a cyanate ester group or an isocyanate group, and having a phosphorous content of 0.3-8 wt.%. Also claimed is an encapsulant for a semiconductor device consisting of (I) and a filler.