| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding carrier which can improve the flatness of an abrasive surface and reduce grinding costs by elongating a lifetime thereof when a semiconductor wafer or a memory disc is ground. SOLUTION: This carrier for a both-surface grinding device has a sun gear having a plurality of pins on the outer periphery, a planetary gear having a plurality of pins on the inner periphery, and a carrier 16 having teeth engaging the sun gear and the planetary gear. When the sun gear is rotated, the carrier 16 performs a planetary movement to grind both surfaces of a work to be ground which is disposed in a work holding hole made in the carrier 16. The teeth 15 of the carrier 16 comprise a plurality of depressions 20 in which the pins are fitted and a plurality of projections 21 formed between the neighboring depressions 20 and the outer surfaces of the depressions 20 are joined to the outer surfaces of the projections 21 with a continuous surface 22. |
