THERMOSETTING RESIN COMPOSITION PRINTED CIRCUIT BOARD USING THE RESIN COMPOSITION ND PROCESS FOR PRODUCING PRINTED CIRCUIT BOARD

摘要

A thermosetting resin composition which comprises a cyanate compound or an isocyanate compound represented by the following general formula (I): A - R1 - A (I) wherein R1 is an aromatic group, an alicyclic group or a mixed group thereof and A is a cyanate group or an isocyanate group, and a poly-(p-hydroxystyrene) derivative represented by the following general formula (II): <CHEM> wherein X is a fluorine atom, a bromine atom and a chlorine atom, R2 is an alkenyl group and an unsaturated carboxyl group, each having 2 to 4 carbon atoms, B is any one of a polymerization initiator residue, a polymerization-terminating agent residue, H and <CHEM> m is an integer of 1 to 4 and n is an integer of 5 to 100, and further containing a compound having at least one N-substituted unsaturated imido group, if required, can produce a printed circuit board of high flame retardness, low dielectric constant, low moisture absorption and a high mechanical strength at an elevated temperature.