发明名称 Epitaxial wafer and method of preparing the same
摘要 A high performance epitaxial wafer which is useful, for example in a light emitting device is produced with a buffer layer. The epitaxial wafer has a substrate of a compound semiconductor selected from a group consisting of GaAs, GaP, InAs and InP. The buffer layer of GaN is grown on the substrate to a thickness within the range of 10 nm to 80 nm. An epitaxial layer of GaN is formed on the buffer layer. The buffer layer is grown at a first temperature by organic metal chloride vapor phase epitaxy, while the epitaxial layer is grown at a second temperature, which is higher than the first temperature, by the organic metal chloride vapor phase epitaxy.
申请公布号 US5843590(A) 申请公布日期 1998.12.01
申请号 US19950574628 申请日期 1995.12.19
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 MIURA, YOSHIKI;FUJITA, KEIICHIRO;TAKEMOTO, KIKUROU;MATSUSHIMA, MASATO;MATSUBARA, HIDEKI;TAKAGISHI, SHIGENORI;SEKI, HISASHI;KOUKITU, AKINORI
分类号 H01L21/20;H01L33/00;H01L33/02;(IPC1-7):B32B18/00 主分类号 H01L21/20
代理机构 代理人
主权项
地址