Carrier element for contactless semiconductor chip-card

摘要

The invention relates to a carrier element for a semiconductor chip (2) with at least two connections (1), especially for installing in chip cards (11). The inventive carrier element has a covering (5) for protecting the semiconductor chip (2). The connections (1) are arranged on one of the main surfaces of the protective covering (5) along two opposite edges only. They consist of a conductive material, and are less thick at the ends oriented towards each other (1a), so that the cross-section has a step on one side only. The semiconductor chip (2) is mounted on the connections (1) in the area of this less thick section (1a) and is mechanically connected to said connections.