A SYSTEM AND METHOD FOR PACKAGING INTEGRATED CIRCUITS
摘要
A system and method for efficiently interconnecting a plurality of ICs (10), thereby improving the electrical performance of the overall system. In one embodiment of the system of the present invention, a plurality of carriers (12) corresponds to a plurality of ICs (10), and a board (14) has a plurality of board regions (16) for receiving the plurality of ICs (10) and are arranged so as to be attached to a backplane (711) forming a vertical stack of boards (714).
申请公布号
WO9853651(A1)
申请公布日期
1998.11.26
申请号
WO1998US10525
申请日期
1998.05.22
申请人
ALPINE MICROSYSTEMS, INC.;BROWN, SAMMY, K.;AVERY, GEORGE, E.;WIGGIN, ANDREW, K.;TODD, TOM, L.;BEAL, SAMUEL, W.
发明人
BROWN, SAMMY, K.;AVERY, GEORGE, E.;WIGGIN, ANDREW, K.;TODD, TOM, L.;BEAL, SAMUEL, W.
