| 摘要 |
PROBLEM TO BE SOLVED: To firmly fix a printed circuit board to a vacuum mounting device in mounting a semiconductor chip on a printed circuit board and in a wire bonding process between the semiconductor chip and a circuit on the board. SOLUTION: A ridge 14 is formed on a face opposite to a face having a semiconductor chip 12b of a board 10, and this ridge 14 surrounds one part of a face 11. This ridge 14 forms a gasket in a surrounding of the vacuum slot of a vacuum mounting device V, so that a rigid face can be formed on the substrate 10 in wire-bonding with a landing 38 of the substrate 10 by ultrasonic crimp. |
