| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a collet in which a semiconductor chip can be prevented from being brought home, and the semiconductor chip can be surely supplied to a prescribed position. SOLUTION: Plural semi-spherical protrusions 16 are formed on a contact face 13 of a collet 11. In the vacuum chuck of a semiconductor chip, those protrusions 16 are deformed elastically, and the contact face 13 is brought into contact with the upper face of the semiconductor chip. When the vacuum chuck is released after the end of carriage, a separating action between the contact face 13 and the semiconductor chip can be operated smoothly by the restoring face of these protrusions 16.</p> |
