| 摘要 |
PROBLEM TO BE SOLVED: To make feasible of the simplification of visual inspection by previously avoiding the air entrailment by a method wherein a semiconductor seal molding device is provided with a seal member annularly sealing a parting surface of a mold, an exhaust hole and an exhaust means so as to hermetically mold a semiconductor element vacuumizing the inner space sealed with the sealing member. SOLUTION: A square annular trench 16 is formed on the parting surface of an upper mold 2U so as to encircle culls 3 and cavity 4 for fitting a sealing member (O ring) 8 in this trench 16. The side face of the O ring 8 protrudes from the parting surface of the upper mold 2U extending over the whole periphery, so that the depth of the trench 16 and the sectional dimension of the O ring 8 may be pertinently decided for sealing the parting surface when the side face is clamped. Besides, an exhaust hole 12 communicating with the outside of the upper mold 2U is made on the position out of the culls 3 and the cavity 4. Furthermore, a connecting pipe 13 connecting one end of a vacuum pipe 17 to the outside of the exhaust pipe is fitted to the outside of the exhaust hole 12. Finally, a vacuum pump 30 is connected to the other end of the vacuum pipe 17. |
