发明名称 Mehrphasenauflagesystem mit Verpackung
摘要 The invention relates to a multi-phase layer system with packaging, characterized in that a first layer (3) which forms an outer wall, a second layer (11) which forms a separating layer and a third layer (14) forming another outer wall are provided . A moist layer (4) is placed between the first (3) and the second layer (11) and a dry layer (13) is placed between the second (11) and the third (14) layer. All directly adjacent layers have a common, interconnected preferably soldered area. In addition, the sides of the second (11) and third (14) layer which face the inner area surrounded by the first (3) and second (11) layers are air-tight and moisture-proof.
申请公布号 DE19720777(A1) 申请公布日期 1998.11.19
申请号 DE1997120777 申请日期 1997.05.17
申请人 PANZNER, BARBARA, 53173 BONN, DE 发明人 PANZNER, BARBARA, 53173 BONN, DE
分类号 B65D81/32;(IPC1-7):A61F13/00 主分类号 B65D81/32
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