Method of making a multi-layer lead frame for a semiconductor device

摘要

A multi-layer lead frame for a semiconductor device includes a signal layer (12) made of a metal strip having a signal pattern including a plurality of lead lines (12a). A power supply or ground layer (14) is adhered and laminated to the signal layer (12) by means of an adhesive film (20). The adhesive film (20) is an electrically insulating connector tape having through holes extending in a thickness direction. Conductive metal vias (20b) are filled in the through holes for electrically connecting the particular power supply or ground layer leads (12b) to the power supply or ground layer (14).