发明名称 |
Method for manufacturing build-up multi-layer printed circuit board |
摘要 |
A method for manufacturing a build-up multi-layer printed circuit board is disclosed which is used in the mother board of a computer, camera-incorporated VTRs, MCMs (multi chip module), CSPs (chip size package) or portable phones. In the build-up multi-layer printed circuit board of the present invention, an inner-layer connecting state is improved. The multi-layer printed circuit board is manufactured by sequentially stacking insulating resin layers and circuit conductor layers based on a build-up method. That is, a first insulating resin layer is necessarily made to undergo an exposure and a development so as to form a first via hole 122. Then a second via hole 124 which is larger than the first via hole 122 is formed on a second insulating resin layer, thereby forming a final V shaped photo via hole 120. Thus build-up multi-layer printed circuit board is manufactured.
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申请公布号 |
US5837427(A) |
申请公布日期 |
1998.11.17 |
申请号 |
US19960693655 |
申请日期 |
1996.08.09 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO CO., LTD. |
发明人 |
HWANG, SE MEYUNG;PARK, KEON YANG;SHIN, YOUNG HWAN |
分类号 |
H05K3/46;H01L21/48;H05K1/11;H05K3/00;(IPC1-7):G03C5/00;B05D5/12 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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