| 摘要 |
PROBLEM TO BE SOLVED: To provide the wire bonder which can automatically switch the lens power of a photographing means to optimum power according to the structure of a bonding target area. SOLUTION: This wire bonder is so constituted as to photograph the bonding position of a semiconductor chip 4 by a CCD camera 1 and perform a specific image process for wire bonding by an image processor 3 by using the video signal of the CCD camera 1. In this case, the CCD camera 1 having a zoom lens 2A, a motor controller 5 which varies and controls the lens power of the zoom lens 2A of the CCD camera 1, a control motor 6, a belt 8, and a pulley 7 are provided and on the basis of bonding position information given by a table feed controller, etc., of a bonder main body side, the motor controller 5 automatically switches the lens power of the zoom lens 2A to optimum power corresponding to the bonding position. |
