| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent burrs from occurring when an aggregate package is divided into unit packages and to enable a solid-state image sensor and an optical part to be mounted at the same position in a semiconductor package and easily connected to a wiring by a method wherein a plane coordinate system is formed on the upside but inside the side of the semiconductor package. SOLUTION: An aggregate package 10a where a required single-layered or multilayered wiring is formed is formed. A prescribed number of openings 11a are provided to the aggregate package 10a at prescribed positions, straight lines each connected between the adjacent openings 11a are made to serve as borders 10b which partition the aggregate package 10a into unit semiconductor packages 10. Three or more cutouts 12 prescribed in number are provided onto the borders 10b at prescribed positions, and a plane coordinate system is formed on the upside of the semiconductor package 10 on the basis of the cutouts 12. The aggregate package 10a is divided along the borders 10b into unit semiconductor packages 10. At this point, the same number of the cutouts 12 are provided to each semiconductor package 10 at the same positions.</p> |
