| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor chip that can increase the wiring capacity of a semiconductor device, which is constituted by mounting the semiconductor chip on a printed wiring board and connecting the chip to the wiring board through bonding wires. SOLUTION: A semiconductor chip 4 is insulated from a circuit pattern 2 on a printed wiring board 1 by sticking an insulating tape 6 to at least part of the lower surface of the chip 4. Therefore, the circuit pattern 2 containing through holes 3 can be formed below the mounting area of the chip 4 and the wiring capacity of the wiring board 1 can be increased. The tape 6 is stuck to the lower surface of the chip 4 by utilizing the pushing-up pins 10 of a pushing-up mechanism section 9 which is used for taking out semiconductor chips maintained in the state of wafers.
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