MULTILAYER LAMINATED BOARD WITH COPPER FOIL AND HIGH DENSITY MULTILAYER PRINTED WIRING BOARD USING IT AND THEIR MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To form a flat printed wiring board having a flat circuit having no depressions nor projections by uniforming the thickness of an insulating resin layer between an inner layer circuit and a copper foil for an outer layer circuit. SOLUTION: A first insulating resin layer 2 is formed on one surface or both surfaces of an insulating board layer 1 and a copper foil 3 for forming an inner layer circuit is formed thereon. Next, the insulating resin layer 2 is heated and pressed on the insulating board layer 1 within a period shorter than a gelling time of the resin to make a laminated board having the copper foil 3 stuck thereon and then the laminated board is etched to form a desired inner layer circuit. If the insulating resin layer 2 does not get, after the inner layer circuit is formed by etching the copper foil 3, the inner layer circuit can be inserted into the insulating resin layer 2 by heating and pressing with a press and the insulating resin layer 2 is cured by keeping heating thereafter. After the insulating resin layer 2 is cured, a flat printed wiring board having a flat circuit having no depressions nor projections can be formed.