| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for applying a lamination tape that can maintain the placement accuracy of a cutter and can adhere electronic component that can form a cutout with a specific depth positively on a viscous layer being laminated on a base, and a method for forming the cut-out of the lamination tape for adhering electronic component. SOLUTION: When a cut-out C is formed on a lamination tape for adhering electronic component, the surface of a support member 24 for receiving the lamination tape is magnetized by a magnet 26. Therefore, when a cutter 1 is to be exchanged, the positions of the cutter 1 and the support member 24 can be adjusted while a tool nose 1a of the cutter 1 is sucked by the magnetized support member 24, thus accurately maintaining the degree of parallelization of the surface of the cutter 1 and the tape support 24, forming the cut-out C with a specific depth at the part of viscous layers 2a, and hence positively applying the viscous layer 2a for adhering electronic component to a work. |
