发明名称 DIELECTRIC WAVEGUIDE LINE AND MULTI-LAYER WIRING BOARD PROVIDED WITH IT
摘要 <p>PROBLEM TO BE SOLVED: To provide the dielectric waveguide line that is used for a high frequency transmission line for a multi-layer wiring board and a semiconductor package in which a conductor loss and a dielectric loss are reduced. SOLUTION: The line is made up of a dielectric base 1 consisting of a laminator of pluralities of dielectric layers, a 1st conductor layer 2 and a 2nd conductor layer 3 formed to upper and lower sides of the dielectric base 1 at least in a direction of line, and side wall via-hole conductors 4 that connect electrically the conductor layers 2, 3 in the dielectric base 1 and are placed in two lines at an interval below a half of a cut wavelength in a direction of line. In this case, a destination constant of a dielectric layer 1b placed in the middle of the dielectric base 1 is selected higher than that of dielectric layers 1a, 1c placed at the 1st conductor layer and the 2nd conductor layer.</p>
申请公布号 JPH10303608(A) 申请公布日期 1998.11.13
申请号 JP19970104907 申请日期 1997.04.22
申请人 KYOCERA CORP 发明人 UCHIMURA HIROSHI
分类号 H01L21/3205;H01L23/52;H01P1/04;H01P3/08;H01P3/12;H05K1/00;H05K1/02;H05K1/03;(IPC1-7):H01P3/12;H01L21/320 主分类号 H01L21/3205
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