发明名称 MANUFACTURE OF PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board wherein two boards and a prepreg formed by impregnating glass cloth with thermosetting resin are used, the prepreg is sandwiched between the boards and laminated, heated and pressed, and a printed wiring board of small warp can be obtained. SOLUTION: In the method for laminating boards 11a, 11b, the two boards are so laminated that the directions L1, L2 wherein the coefficients of linear expansion of the respective boards are large intersect with each other, In other case, two boards are so laminated that the coefficient of linear expansion of one board in the X direction is larger than that of the other board in the X direction, and that the coefficient of linear expansion of the one board in the Y direction is larger than that of the other board in the Y direction.
申请公布号 JPH10303556(A) 申请公布日期 1998.11.13
申请号 JP19970111315 申请日期 1997.04.28
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SAITO KIMIAKI;SHIBATA KEIJI;YAMADA MUNETOSHI;TAKAZOE TOMOKI
分类号 B32B17/04;H05K3/22;H05K3/46;(IPC1-7):H05K3/46 主分类号 B32B17/04
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