发明名称 |
Fabrication of customized integrated circuits |
摘要 |
A technique for production of customized integrated circuits comprising the steps of providing an integrated circuit blank having at least first and second metal layers (410, 412) including portions arranged for selectable removal, to provide desired customization of said integrated circuit blank, and thereafter etching at least said first metal layer (410 or 412) to customize said integrated circuit blank. |
申请公布号 |
HK1004031(A1) |
申请公布日期 |
1998.11.13 |
申请号 |
HK19980103047 |
申请日期 |
1998.04.14 |
申请人 |
CHIP EXPRESS (ISRAEL) LTD |
发明人 |
ZVI ORBACH;ISRAEL JANAI MEIR |
分类号 |
H01L21/82;H01L;H01L21/3205;H01L21/768;H01L23/52;H01L23/525;H01L27/118;(IPC1-7):H01L |
主分类号 |
H01L21/82 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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