| 摘要 |
<p>The invention pertains to a method for coupling a cooling element to an apparatus or its part including electronic components to be cooled. The cooling element (1) according to the invention is preferably surface mounted to a thermally conductive printed circuit board (5). The invention also pertains to a cooling element comprising a cooling jacket (2) and connector part (3; 3a, 3b). The cooling element (1) is surface mountable by its connector part (3; 3a, 3b) to a printed circuit board (5).</p> |
