SLICING DEVICE USING YARN FOR CUTTING THIN WAFERS USING THE ANGULAR INTERSECTION OF AT LEAST TWO YARN LAYERS

摘要

The invention concerns a slicing device using yarn comprising at least two yarn-guide cylinders (4) on which the yarn (2) is wound and by which it can be moved with a reciprocating or continuous motion pressed against a piece to be sliced (1) fixed on a supporting table (3). The yarn (2) is wound on the yarn-guides (4) so as to form at least two layers of yarns (2) intersecting with one or several non-null intersecting angles ( beta ) and so as to pass in a straight line from one cylinder to the other. Adjusting means are provided for setting the angle of inclination between the moving direction (5) of the piece to be sliced and a line perpendicular to the plane of the yarn cylinder (4) axes so as to obtain strictly parallel slices. The intersection of the yarn layers (2) improves the quality of the slices obtained by facilitating the subsequent mechanical treatment operations of surfaces with crossed faults. Moreover, the angle of the yarn layers (2) reduces the shearing and torsional stresses on the support (3) of the piece to be sliced (1) when the slices are being cut.