发明名称 |
IGBT with latch-up prevention and short circuit strength |
摘要 |
The insulated gate bipolar transistor includes, on a first layer first surface, formed a second semiconductor layer of second conductivity, while a first semiconductor region (106,108) of first conductivity is formed in a surface of the second layer. In a surface of the first region is formed a second semiconductor region (124) of second conductivity, while an insulating film (114) is located on the first face. The insulating film carries a control electrode (116), while a first main electrode (120) is formed on the second region by a continuous contact section (121). Between the first and second region is formed a third semiconductor region (110) of first conductivity covering almost the entire bottom of the second region. The second region contains three parts (124a,b,c), each of specified design. |
申请公布号 |
DE19810338(A1) |
申请公布日期 |
1998.11.12 |
申请号 |
DE1998110338 |
申请日期 |
1998.03.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD., SUWON-CITY, KYUNGKI-DO, KR |
发明人 |
TAE-HOON, KIM, PUCHON, KYUNGGI, KR |
分类号 |
H01L29/78;H01L29/06;H01L29/08;H01L29/68;H01L29/739;(IPC1-7):H01L29/739 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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