发明名称 LEAD FRAME MANUFACTURING DEVICE UTILIZING LASER AND MANUFACTURE OF LEAD FRAME UTILIZING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a lead frame manufacturing device utilizing laser and a method of manufacturing lead frame utilizing the same. SOLUTION: The lead frame manufacturing device is equipped with a laser generator 100 arranged on the top, a laser irradiating route tube 102 mounted below the laser generator 100, a lead frame transfer component 106 placed under the laser irradiation route tube 102 and a laser absorption component 110 placed under the lead frame transfer component 106 and supporting the lead frame transfer component. Thereby, more exquisite work of pattern than in the conventional stamping work or etching is available.
申请公布号 JPH10296464(A) 申请公布日期 1998.11.10
申请号 JP19980104940 申请日期 1998.04.15
申请人 SAMSUNG AEROSPACE IND LTD 发明人 HAN SUNG-YOUNG
分类号 B23K37/00;B23K26/00;B23K26/06;H01L23/00;H01L23/495;H01L23/50 主分类号 B23K37/00
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