发明名称 Movably mounted heat receiving plate
摘要 The present invention is to provide a heat sink used for a portable information processing apparatus, the casing of which has a recess in which an exchangeable arithmetic processor is accommodated. There is provided a heat receiving plate closely coming into contact with the arithmetic processor. The heat receiving plate includes a round hole portion arranged at one end. A heat pipe is inserted into the round hole portion. A fixing member is attached to the heat receiving plate at an outlet portion of the heat pipe arranged in the round hole portion. The heat receiving plate is fixed to the casing through the fixing member so that a hinge mechanism can be formed by the heat receiving plate and the heat pipe which is used as a fulcrum. At least a portion of the heat pipe is thermally connected with a radiating member.
申请公布号 US5835348(A) 申请公布日期 1998.11.10
申请号 US19960739285 申请日期 1996.10.29
申请人 DIAMOND ELECTRIC MFT. 发明人 ISHIDA, YOSHIO
分类号 H01L23/427;G06F1/20;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/427
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