| 摘要 |
PROBLEM TO BE SOLVED: To obtain a high resolution image at low cost without causing any trailing by even in the case of sublimation transfer by suppressing storage of heat in a recording head. SOLUTION: An adhesive layer 18 is sandwiched between a substrate 14 carrying a heating element 16 and a heat dissipation plate 20 made of a material excellent in thermal conductivity. More specifically, the substrate 14 for heating element is bonded to the heat dissipation plate 20 through an adhesive and the thickness of the adhesive layer 18 is set at 8μm or less at least in the vicinity of the heating element 16. According to the structure, heat generated from the heating element 16 and stored in the substrate 14 therefor is dissipated effectively to the atmosphere through the heat dissipation plate 20.
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