发明名称 |
Multi-chip semiconductor chip module |
摘要 |
A semiconductor device including a plurality of chip units each defined by a side wall and arranged in a state such that a side wall of a chip unit abuts a corresponding side wall of an adjacent chip unit, and an interconnection structure for interconnecting a plurality of terminals of a side wall of a chip unit to corresponding terminals of a side wall of an adjacent chip unit that abuts the chip unit at the respective side walls. |
申请公布号 |
US5834843(A) |
申请公布日期 |
1998.11.10 |
申请号 |
US19950427111 |
申请日期 |
1995.04.21 |
申请人 |
FUJITSU LIMITED |
发明人 |
MORI, SYUJI;SEKIBA, TAKASI;KUDO, OSAMU |
分类号 |
H01L25/18;H01L23/498;H01L25/04;H01L25/065;(IPC1-7):H01L23/34 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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