发明名称 Method for mounting electrical components
摘要 <p>An electrical device for mounting electrical components includes an integrally die-cast aluminum base 20 having at an upper side thereof recesses 20a for receiving the electrical components and at the bottom side thereof radiator fins 20b for radiating heat generated by the electrical components. The terminals 31 of the electrical components accommodated in the recesses of the metal base 20 are substantially at the same height and electrical interconnection among them is secured via the conductors 21a carried on a printed circuit board 21. A high heat conductivity resin material 29 is interposed between the recesses and components 22, 23, and 27 that generate a large amount of heat. On the other hand, a heat insulating resin material 30 is interposed between the recess and the component 26 that generates a small or negligible amount of heat. <IMAGE></p>
申请公布号 HK1003819(A1) 申请公布日期 1998.11.06
申请号 HK19980103009 申请日期 1998.04.09
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 SATORU HAYASHI
分类号 H01L23/40;H02M7/00;H05K1/02;H05K1/18;H05K3/32;H05K7/06;H05K7/20;(IPC1-7):H05K;H04L 主分类号 H01L23/40
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