发明名称 METHOD OF MANUFACTURING ENVELOPED ELECTRIC, ELECTRONIC OR ELECTROMECHANICAL COMPONENTS OF SMALL DIMENSIONS
摘要 <p>The invention relates to a method of manufacturing electric, electronic and electromechanical components, and combinations thereof, enveloped in an electrically insulating material, which components may or may not be incorporated in a circuit, wherein (a) components are provided on, or in cavities in, a plate of an electrically insulating material, metal films being applied to the surface of the plate so as to establish electric contact with the components; (b) after the provision of the components, the plate of an electrically insulating material is covered on one side or on both sides with a plate of an electrically insulating material which is hermetically secured to the plate of an electrically insulating material supporting the components; (c) the assembly is subdivided into blocks, with partition lines cutting into the metal films which serves to make electric contact with the components; (d) and, subsequently, the blocks are provided with two or more electric contacts. The invention also relates to components enveloped in the manner described herein. Enveloped components obtained by means of this method exhibit a high dimensional accuracy.</p>
申请公布号 WO1998049878(A1) 申请公布日期 1998.11.05
申请号 IB1998000352 申请日期 1998.03.16
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址