发明名称 VISIBLY EXPOSABLE SAND BLAST RESISTANT PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM USING THE SAME AND CUTTING METHOD FOR PROCESSED MATERIAL USING BOTH
摘要 PROBLEM TO BE SOLVED: To provide a highly sensitive and sand blast resistant photosensitive composition allowing direct exposure for drawing with a visible ray by containing a specific urethane (meta)acrylate compound, an alkali soluble polymeric compound and a photochemical polymerization component respectively. SOLUTION: A material for use is a visibly exposable sand blast resistant photosensitive composition containing a photochemically polymerized urethane (meta)acrylate compound (a) having at least two (meta)acryloyl groups, an alkali soluble polymeric compound (b) having an acid value between 50 mg/KOH and 250 mg/KOH, and at least one compound selected from a titanosane compound c-1, an acridine compound and a triazine compound as a photochemical polymerization initiator (c). Also, a visibly exposable sand blast resistant dry film 1 has a structure where a base material 2, a sand blast resistant photosensitive resin layer 3 and a protection material layer 4 are stacked in order and integrated with one another.
申请公布号 JPH10293400(A) 申请公布日期 1998.11.04
申请号 JP19970116170 申请日期 1997.04.18
申请人 TOKYO OHKA KOGYO CO LTD 发明人 OBITANI HIROYUKI
分类号 G03F7/027;G03F7/029;G03F7/40;H01J11/22;H01J11/34;H01J11/36;H01J11/38;(IPC1-7):G03F7/027;H01J11/02 主分类号 G03F7/027
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