| 摘要 |
PROBLEM TO BE SOLVED: To accurately detect a defect of a pattern at a high speed. SOLUTION: A 1st master pattern is generated from CAD data on a measured pattern (step 102). The 1st master pattern is shrinked at right angles to its center line to generate a 2nd master pattern for deficit or open-circuit detection, and the 1st master pattern is expanded at right angles to its center line to generate a 3rd master pattern for projection or short-circuit detection (step 103). Areas corresponding to the 2nd and 3rd master patterns are binarized by using different threshold values (step 106). The binarized measured pattern is ANDed with the 2nd and 3rd master pattern to detect a defect of the measured pattern (step 108). |
