PACKAGE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the length of a grounding conductor extended from a semiconductor chip mounted on a metallic heat sink without forming via holes in the chip. SOLUTION: A semiconductor chip 101 is mounted on the central part of a metallic heat sink 100. A pair of metallic projecting strip sections 110 which are extended longer than the chip 101 along the paired facing sides of the chip 101 is provided on the outsides of the facing sides of the chip 101 on the plate 100. On the opposite side of the chip 101 to the projecting strip sections 110 on the heat sink 100, circuit boards 102 are respectively mounted. The upper surface of the chip 101 is connected to the upper surface of each projecting strip section 110 through a third bonding wire 113 for grounding.