| 摘要 |
PROBLEM TO BE SOLVED: To eliminate falling of inner leads and defective bonding by setting the rear width in the vicinity of the forward end part of each inner lead equal to or wider than the front width where a semiconductor integrated circuit chip is connected electrically. SOLUTION: The inner lead 5 of a lead frame is made wider in the vicinity of the forward part thereof than the rear surface 7 where wire bonding is performed. Since stability is enhanced in the vicinity of the forward end part of the inner lead 5 where wire bonding is performed, the inner lead 5 can be prevented from falling even if it is pushed by a wire bonding header at the time of wire bonding. Consequently, the wire bonding header can come into correct contact with the surface 6 of the inner lead and defective bonding can be prevented. |
