Wafer backing member for mechanical and chemical-mechanical planarization of substrates

摘要

A wafer backing member for use in a wafer carrier of a chemical-mechanical planarization machine between the wafer carrier and the backside of a semiconductor wafer or other substrate. In one embodiment, the backing member has a body including a first layer to abut against the backside of the wafer and a second layer to abut against the wafer carrier. The first layer is substantially rigid or substantially non-compressible to preferably inhibit flexing of the wafer, and the second layer is resiliently compressible to cushion the backside of the wafer. In operation, the compressible second layer reduces the differences in pressure from one area of the wafer to another and the rigid first layer distributes the forces more uniformly across the backside of the wafer. As a result, the wafer backing member substantially reduces the center-to-edge difference in polishing rates to more uniformly planarize the front face of the wafer.